期刊
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
卷 162, 期 8, 页码 D354-D359出版社
ELECTROCHEMICAL SOC INC
DOI: 10.1149/2.0561508jes
关键词
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资金
- MOTIE(Ministry of Trade, Industry Energy [10048778]
- KSRC(Korea Semiconductor Research Consortium)
- Basic Science Research Program through National Research Foundation of Korea (NRF) - Ministry of Education, Science and Technology [2012R1A1A1004731]
The electrolyte for Cu superfilling generally consists of copper sulfate, sulfuric acid, a chloride ion, an accelerator, and a suppressor. In this study, the characteristics of citric acid-based electrolytes and the interaction between citrate species and accelerators are investigated, with the ultimate goal being the replacement of both sulfuric acid and the suppressor with citric acid. Electrochemical impedance measurements were adopted to measure the changes in solution and charge transfer resistances with respect to citric acid and accelerator concentrations. In addition to a decrease in solution resistance resulting from the addition of citric acid, charge transfer inhibition was observed during Cu electrodeposition, which is likely the result of adsorption of citrate species onto Cu surface. A competitive adsorption between the citrate species and the accelerator was also observed and the new additive system was applied to the feature filling in the absence of the conventional polyethylene glycol suppressor. Using this new copper sulfate, citric acid, chloride ion, and accelerator system, trenches were successfully bottom-up filled, resulting in no internal defects. (C) The Author(s) 2015. Published by ECS.
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