期刊
EUROPEAN POLYMER JOURNAL
卷 49, 期 11, 页码 3642-3650出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.eurpolymj.2013.07.034
关键词
Coefficient of thermal expansion; Polyimide film thickness; Flexible display; Flexible substrate
Polyimide films with thicknesses ranging from 6 mu m to 80 mu m were prepared with a solvent casting method to explore film thickness effects on the in-plane thermal expansion coefficient (CTE). In the case of polyimide films composed of bulky and flexible molecular units, CTE is consistent regardless of film thickness. In contrast, films with rigid and planar molecular structure show CTE increase according to the increase of film thickness up to 40-50 mu m, which then plateau for thicker films. It is apparent that the film thickness dependent thermal expansion originates from complex effects of molecular orientation, charge transfer complex formation, and crystal formation as a function of film thicknesses, through characterization on UV-Vis absorption, crystalline structure, glass transition behavior, and optical retardation. These results provide insight into the design of polymer structures for flexible display substrates that require appropriate CTE values. (C) 2013 Elsevier Ltd. All rights reserved.
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