4.7 Article Proceedings Paper

Quantifying crack tip displacement fields with DIC

期刊

ENGINEERING FRACTURE MECHANICS
卷 77, 期 11, 页码 2063-2076

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.engfracmech.2010.03.025

关键词

Crack tip displacement fields; Digital image correlation; K; T-stress; CTOA

资金

  1. Engineering and Physical Sciences Research Council [EP/F023464/1] Funding Source: researchfish
  2. EPSRC [EP/F023464/1] Funding Source: UKRI

向作者/读者索取更多资源

Crack paths under both fatigue and fracture conditions are governed by the crack tip displacement field and the material deformation characteristics, including those influenced by metallurgical anisotropy. Experimental techniques such as thermoelasticity and photoelasticity have been successfully used to characterise the elastic stress fields around cracks but they do not take into account either plasticity or anisotropy. Considerable work has been carried out to characterise crack tip stress fields from displacement measurements. The current method of choice for obtaining displacement field data is digital image correlation (DIC) which has undergone significant advances in the recent years. The ease of use and capabilities of the technique for full field displacements has led to improved methods for characterising crack tip displacement fields based on data obtained from DIC. This paper gives an overview of some of the applications of DIC for crack tip characterisation such as K, T-stress and crack tip opening angle (CTOA) measurements as well as data obtained from 3D measurements of a propagating crack. (c) 2010 Elsevier Ltd. All rights reserved.

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