期刊
ELECTROCHEMISTRY COMMUNICATIONS
卷 12, 期 5, 页码 611-615出版社
ELSEVIER SCIENCE INC
DOI: 10.1016/j.elecom.2010.02.012
关键词
Galvanic replacement; SECM; Microfabrication
Galvanic replacement represents a highly significant process for the fabrication of bimetallic materials, but to date its application has been limited to either modification of large area metal surfaces or nanoparticles in solution. Here, the localised surface modification of copper and silver substrates with gold through the galvanic replacement process is reported. This was achieved by generation of a localised flux of AuCl(4)(-) ions from a gold ultramicroelectrode tip which interacts with the unbiased substrate of interest. The extent of modification with gold can be controlled through the tip substrate distance and electrolysis time. (c) 2010 Elsevier B.V. All rights reserved.
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