4.6 Article

The 8-inch free-standing CVD diamond wafer fabricated by DC-PACVD

期刊

DIAMOND AND RELATED MATERIALS
卷 19, 期 10, 页码 1168-1171

出版社

ELSEVIER SCIENCE SA
DOI: 10.1016/j.diamond.2010.05.002

关键词

Large-area; Diamond thick film; DC-PACVD; Free-standing diamond wafer

资金

  1. Ministry of Education, Science and Technology, Republic of Korea [2009K000414]
  2. Ministry of Knowledge Economy, Republic of Korea
  3. Korea Evaluation Institute of Industrial Technology (KEIT) [K0006074] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
  4. National Research Foundation of Korea [15-2008-00-006-00] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

向作者/读者索取更多资源

We report the fabrication of the 8-inch free-standing CVD diamond wafers by DC-PACVD process with the diode-type electrode configuration. Methane-hydrogen gas mixture was used as the precursor gas. The methane volume % in hydrogen, the gas flow rate and the chamber pressure were 5 similar to 12%, 400 sccm and 100 similar to 130 Torr, respectively. The discharge voltage and the discharge current were 840 910 V and 90 similar to 110 A. respectively. The substrate temperature was 1200 similar to 1300 degrees C. The thermal conductivity, crystallinity and microstructure were characterized by the converging thermal wave technique. Raman spectroscopy, optical microscopy and SEM, respectively. The maximum growth rate was 9 mu m/h for thermal grade 8-inch wafer. The deviation of thickness and the thermal conductivity over the 8-inch wafer was around 10% of the respective averaged values. The distribution of FWHM of Raman diamond peak over the wafer surface also showed excellent uniformity. The extremely simple scale-up of the present deposition technology was demonstrated. (c) 2010 Elsevier B.V. All rights reserved.

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