4.6 Article Proceedings Paper

Use of carbon nanotubes for VLSI interconnects

期刊

DIAMOND AND RELATED MATERIALS
卷 18, 期 5-8, 页码 957-962

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ELSEVIER SCIENCE SA
DOI: 10.1016/j.diamond.2009.02.008

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Carbon nanotubes; Electronic applications; Chemical vapour deposition; Growth

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The requirements for using carbon nanotubes as interconnects in future integrated circuits are defined. Growth techniques and some methods of their characterisation are described. The need to grow nanotubes on conducting metal substrates is pointed out and this effort is starting. (C) 2009 Elsevier B.V. All rights reserved.

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