期刊
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
卷 25, 期 8, 页码 -出版社
IOP PUBLISHING LTD
DOI: 10.1088/0960-1317/25/8/085008
关键词
microwave bonding; PMMA; microfluidics
类别
资金
- NSERC
- nanoBridge
- CMC Microsystems
- Alberta Innovates [201400199] Funding Source: researchfish
In this paper, a novel low-cost, rapid substrate-bonding technique is successfully applied to polymethyl methacrylate (PMMA) microfluidics bonding for the first time. This technique uses a thin intermediate metallic microwave susceptor layer at the interface of the bonding site (microchannels) which produces localized heating required for bonding during microwave irradiation. The metallic susceptor pattern is designed using a multiphysics simulation model developed in ANSYS Multiphysics software (high-frequency structural simulation (HFSS) coupled with ANSYS-Thermal). In our experiments, the required microwave energy for bonding is delivered using a relatively inexpensive, widely accessible commercial microwave oven. Using this technique, simple PMMA microfluidics prototypes are successfully bonded and sealed in less than 35 seconds with a minimum measured bond strength of 1.375 MPa.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据