期刊
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
卷 24, 期 6, 页码 2040-2048出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2015.2466540
关键词
Vapor chamber; thermal ground plane; flexible heat pipe; thermal management
类别
资金
- U.S. Central Intelligence Agency [2013-13071200006]
- Defense Advanced Research Projects Agency [N6601-08-2006]
- State of Colorado through the Advanced Industries Accelerator
- Intelligence Community Postdoctoral Research Fellowship Program through the Office of the Director of National Intelligence
Thermal ground planes (TGPs) are passive thermal management devices that utilize the latent heat associated with phase change to achieve high effective thermal conductance, similar to heat pipes. In this paper, we develop flexible TGPs with an ultra-thin thickness of 0.5 mm using copper-cladded polyimide as the encasing material, woven copper mesh as a wick, and electroplated copper pillars to support a vapor core. The lowest thermal resistance of one TGP is characterized to be only 1/3 that of an equivalently sized copper heat spreader. The effects of size scaling of evaporator and condenser, and overall TGP sizes on the thermal resistances of TGPs are experimentally characterized. A simple series thermal resistance model, which accounts for vapor core thermal resistance, is developed to predict the measured results. This experimentally validated model can be used for the design of TGPs with varying sizes of evaporator and condenser, and overall size. [2015-0032]
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