4.7 Article

Exfoliated hexagonal boron nitride-based polymer nanocomposite with enhanced thermal conductivity for electronic encapsulation

期刊

COMPOSITES SCIENCE AND TECHNOLOGY
卷 90, 期 -, 页码 123-128

出版社

ELSEVIER SCI LTD
DOI: 10.1016/j.compscitech.2013.10.018

关键词

Nanocomposites; Polymer-matrix composites (PMCs); Thermal properties; Scanning/transmission electron microscopy (STEM)

资金

  1. Semiconductor Research Corporation (SRC) [2287]

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Hexagonal boron nitride (h-BN) nanosheet is a novel high thermal conductivity and high aspect ratio filler that has the potential to substantially enhance the thermal conductivity of polymer composites. We prepared h-BN nanosheet by liquid exfoliation of bulk h-BN flakes, and demonstrated the enhanced thermal conductivity of its epoxy composite. It is found that the enhancement of thermal conductivity by using h-BN nanosheet is substantial at low filler loadings. At a loading of 5 wt%, the thermal enhancement factor is 113% for exfoliated h-BN nanosheets, and is only 28% for h-BN control. It is also noted that the effect of using h-BN nanosheets becomes less obvious at high filler loading probably due to the large thermal boundary resistance. Infrared thermal imaging measurement confirmed that the resulting h-BN nanosheet/epoxy nanocomposite can successfully reduce the thermal resistance between Cu-Si interfaces when being used as thermal conductivity adhesives. Further, detailed characterizations on the flow-ability, thermomechanical properties and moisture adsorption, etc. revealed the promising application of the BN nanosheet/epoxy nanocomposite for electronic encapsulation. (C) 2013 Elsevier Ltd. All rights reserved.

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