Bonding of BisGMA-TEGDMA-Resin to Bulk Poly(Paraphenylene) Based Rigid Rod Polymer

Objectives: The aim of this study was to find a way to adhere dimethacrylate-resin to poly(paraphenylene) based rigid rod polymer (RRP) substrate. Methods: The effect of resin dissolving time on RRP substrate and effect of different surface treatments were tested in this study. Tested surface treatments contained solvent dichloromethane (DCM) based primers or additional treatment at an increased temperature of the substrate. Shear bond strength test and scanning electron microscope (SEM) analyses were chosen for test methods. Results: Results confirmed that by increasing the dissolving time of resin on the surface of RRP substrate the bond strengths increased (ANOVA p < 0.05). Temperature increase at the substrate increased bond strength (p < 0.05). Of the solvent DCM based primers, the primer which contained dimethacrylate-resin and dissolved RRP increased bond strength (p < 0.05). SEM evaluation suggested that the reason for the increased bond strengths was related to the alteration of the RRP substrate's bonding surface. Significance: Within the limitations of this study it can be concluded that improved adhesion between dimethacrylate-resin and poly(paraphenylene) based RRP was possible to obtain. (C) Koninklijke Brill NV, Leiden, 2011