4.3 Article

Investigation of thermoplastic hot embossing process using soft polydimethylsiloxane (PDMS) micromold

期刊

JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY
卷 29, 期 12, 页码 5063-5067

出版社

KOREAN SOC MECHANICAL ENGINEERS
DOI: 10.1007/s12206-015-1102-1

关键词

Hot embossing; Micromold; Mold deformation; Polydimethylsiloxane; Thermoplastic

资金

  1. International Collaborative R&D Program through the Korea Institute for the Advancement of Technology (KIAT) - Ministry of Trade, Industry and Energy [N0000894]
  2. Basic Science Research Program through the National Research Foundation of Korea (NRF) - Ministry of Science, ICT & Future Planning [NRF-2014R1A1A1008487]

向作者/读者索取更多资源

A hot embossing process using a soft polydimethylsiloxane (PDMS) micromold was experimentally investigated. Although the PDMS micromold shows several advantages, including short fabrication time, high flexibility, and easy modification of surface properties, a mold deformation during the embossing process is inevitable because of its low Young's modulus. In this regard, hot embossing experiments were systematically carried out to investigate the effect of major processing parameters on the soft micromold deformation. By measuring characteristic geometrical dimensions of the replicated microfeatures from the deformed microcavity, the deformation behavior of the soft micromold was analyzed.

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