期刊
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
卷 26, 期 6, 页码 3629-3637出版社
SPRINGER
DOI: 10.1007/s10854-015-2880-z
关键词
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In this study, microstructure and mechanical properties of Sn-xBi solder alloy were investigated. In Sn-3.6Bi and Sn-7.25Bi solder alloys, the particle-shaped Bi phase distributed in Sn-rich phase matrix. In Sn-14.5Bi and Sn-29Bi solder alloys, the shape of Bi phase was irregular. In Sn-58Bi solder alloy, the island-shaped Sn-rich phase distributed in Bi phase uniformly. The hardness of Sn-xBi was improved from 11.36 to 27.04 MPa first and declined to 10.05 MPa then when the Bi fraction was increased form 0 to 100 wt%. The bend fracture energy of Sn-58Bi showed a dependence on the loading speed. Moreover, the bend fracture energy of Sn-29Bi solder alloy was lower than that of Sn-14.5Bi and Sn-58Bi, which was caused by the special microstructure of Sn-29Bi.
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