期刊
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
卷 26, 期 12, 页码 9396-9401出版社
SPRINGER
DOI: 10.1007/s10854-015-3152-7
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资金
- U.S. Office of Naval Research [N00014-13C0234]
The dielectric and high voltage performance of polymethylpentene (PMP) is investigated and compared with biaxially-oriented polypropylene (BOPP) for high power density and high temperature capacitor applications. PMP has a melting temperature that is around 60 A degrees C higher than BOPP, while still maintaining low dielectric loss and high charge-discharge efficiency that are comparable to the latter. Furthermore, PMP is the lightest commercial thermoplastic polymer with density of 0.83 g/cm(3), which is 8 % lower than BOPP (0.9 g/cm(3)). PMP is a promising semicrystalline dielectric material that may replace BOPP for high temperature pulsed power and power conditioning applications.
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