期刊
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
卷 27, 期 2, 页码 1177-1183出版社
SPRINGER
DOI: 10.1007/s10854-015-3870-x
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Effect of Al on the microstructure and mechanical properties were investigated. The results showed that Al could depress the formation of eutectic phase in Sn-Cu-Al solder alloy. The intermetallic compounds of Sn-0.7Cu-0.03Al were refined compared with that of Sn-0.7Cu-0.015Al. Segregated CuAl intermetallic compound was observed in Sn-0.7Cu-0.15Al and Sn-0.7Cu-0.5Al solder alloy. Sn-whisker was observed on the polished surface of Sn-0.7Cu-0.15Al and Sn-0.7Cu-0.5Al. The ultimate tensile strength of Sn-0.7Cu-0.03Al and Sn-0.7Cu-0.5Al was found to be higher than that of Sn-0.7Cu-xAl (x = 0, 0.015 and 0.15). The elongation of Sn-0.7Cu-0.015Al was the highest. The creep performance of Sn-0.7Cu-0.03Al and Sn-0.7Cu-0.5Al was similar and higher than that of Sn-0.7Cu and Sn-0.7Cu-0.15Al.
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