期刊
JOURNAL OF MATERIALS SCIENCE
卷 51, 期 1, 页码 33-49出版社
SPRINGER
DOI: 10.1007/s10853-015-9354-9
关键词
-
资金
- Russian Ministry of Education and Science [14.B25.31.0017]
- Spanish Ministry of Economy and Competitiveness [RYC-2011-08881]
Mechanical strength and electrical conductivity are the most important properties of conducting metallic materials used in electrical engineering. Today, there is a growing need in this field for innovative conductor materials with improved properties. Meanwhile, the main issue is that high electrical conductivity and high strength are usually mutually exclusive due to physical nature of these properties. Alloying of pure metals results in significant increase of their mechanical strength, whereas electrical conductivity dramatically drops due to the scattering of electrons at solutes and precipitates. Recent studies have shown that intelligent nanostructural design in Al, Cu, and their alloys can improve combination of high mechanical strength with enhanced electrical conductivity. It was demonstrated that mechanical strength and electrical conductivity of these materials are primarily controlled by their microstructure, of which grain size, morphology of second phases, and their distribution, as well as dislocation structure, are the most important parameters. Rapid development of the state-of-the-art methods for the microstructural characterization at nano- and atomic scale has allowed a deeper insight into microstructure-properties relationship. The approach of intelligent nanostructural design of Al and Cu alloys has even enabled to increase the material strength with simultaneous improvement of its electrical conductivity. In this case, recent works on nanostructuring alloys by severe plastic deformation are of special interest, which gives rise to fundamental questions dealing with new mechanisms of strength and electrical conductivity as well as innovation potential of practical application of nanostructured materials. These issues are considered and discussed in the present progress article.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据