期刊
JOURNAL OF LIGHTWAVE TECHNOLOGY
卷 33, 期 5, 页码 991-997出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JLT.2015.2390675
关键词
Electronics packaging; photonic integrated circuits; semiconductor device packaging; silicon photonics
资金
- III-V Lab (SOA devices)
- IMEC
- CEA-Leti (Si photonic ICs)
- ST Microelectronics (electronic ICs)
Fiber optic interconnection processes and hybrid integration of electronic devices for high speed Si photonic systems are presented. Thermal effects arising from these hybrid integration processes are also investigated. An overview of ePIXfab which offers affordable access to an advanced Si photonic foundry service is also presented. This includes the presentation of fundamental photonic packaging design rules which can greatly reduce the time and cost associated with the development of complex Si photonic devices.
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