期刊
JOURNAL OF LIGHTWAVE TECHNOLOGY
卷 33, 期 5, 页码 976-983出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JLT.2014.2376174
关键词
silicon photonics; photonic integrated circuit; hybrid integration; tunable laser; semiconductor optical amplifier; wafer bonding; optical network; packet switching; Directly modulated laser; NG-PON2
资金
- European FP7 Plat4M
- French national ANR projects Ultimate
- Fabulous project
Recent advances on hybrid III-V/Si lasers and semiconductor optical amplifiers using wafer bonding are reported. Hybrid optical amplifiers exhibit 28 dB internal gain, 9 dBm saturation power in the output silicon waveguide, and 10-11 dB of internal noise factor. Moreover, using optical amplifiers as optical gates, we demonstrate a successful switching operation of optical packet/burst without penalties compared to classical optical amplifiers. The hybrid silicon lasers allow single mode operation and wavelength tunability over 30 nm by exploiting silicon ring resonators thermo-optical effect. Moreover transmission over 60 km single-mode fiber at 10 Gb/s from a directly modulated III-V on Silicon hybrid laser is also demonstrated. Finally, we achieved 21.4 Gb/s modulation over 12 wavelengths using a high-speed directly modulated silicon hybrid laser with improved E/O bandwidth.
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