期刊
CERAMICS INTERNATIONAL
卷 40, 期 5, 页码 7539-7544出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.ceramint.2013.12.105
关键词
Metal matrix composites; Thermophysical properties; Interpenetrating structure; Electronic packaging
Silicon carbide (SiC) reinforced aluminum composites with three dimensional interpenetrating network structure (3D-SiC/Al) were fabricated by the gas pressure infiltration method, and their thermophysical properties were investigated. The results show that the geometry of SiC reinforcement has a significant impact on the thermophysical properties of the composites. Continuous SiC reinforced aluminum composites (3D-SiC/Al) have higher thermal conductivities and lower coefficients of thermal expansion (CETs) than those of particulate SiC reinforced aluminum composites (SiCp /Al) with the same SiC volume fraction. The co-continuous structures of both the SiC reinforcement and the Al matrix in 3D-SiC/Al can be the reason behind this phenomena. As a result, when SiC volume fraction values were the same, 3D-SiC/Al composites will be more suitable for electronic packaging applications comparing with SiCp/Al composite. (c) 2013 Elsevier Ltd. and Techna Group S.r.l. All rights reserved.
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