期刊
JOURNAL OF DISPERSION SCIENCE AND TECHNOLOGY
卷 24, 期 3-4, 页码 291-304出版社
MARCEL DEKKER INC
DOI: 10.1081/DIS-120021792
关键词
soft lithography; microcontact printing; replica molding; structuring; micro structures; PDMS
The burgeoning area of soft lithography is reviewed with special emphasis on developments within the past three years. Applications in electronics have driven such developments, but more recently, other kinds of device structures and 3D prototyping have also found application, in part, through soft lithography. Microcontact printing (muCP), lift off muCP nano transfer printing (nTP), micromolding in capillaries (MIMIC), solvent assisted micromolding (SAMIM), replica molding (REM), and microtransfer molding are the main soft lithography schemes discussed.
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