Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders

The formation of Ni3P layers in Sn(Cu)/Ni(P) reaction couples were limited compared to Sn/Ni(P). The sluggish growth of the Ni3P layer was Attributed to a Cu-Sn compound layer formed on the Ni(P) substrate, and it depended on the Ni diffusion in the Cu-Sn compound. (C) 2003 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.