期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 32, 期 11, 页码 1257-1264出版社
MINERALS METALS MATERIALS SOC
DOI: 10.1007/s11664-003-0020-7
关键词
composite lead-free solder joints; mechanical behavior; IMC morphology
Mechanical incorporation of metallic particles in the Sn-Ag-based solder resulted in various intermetallic compound (IMC) morphologies around these particles during reflow. Unlike with the Ni particles, the IMCs formed around Cu and Ag particles are relatively insensitive to reflow profiles employed. The IMC formed around the Ni particles ranges from sunflower morphology to blocky morphology with increasing time and temperature above liquidus during the heating part of the reflow profile. Mechanical properties, such as simple shear strength and creep behavior, of these composite solders were affected by the IMC morphologies in the composite solders investigated. Sunflower-shaped IMC formed around an Ni particles resulted in higher simple shear strength and better creep properties.
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