期刊
IEEE ELECTRON DEVICE LETTERS
卷 24, 期 1, 页码 40-42出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2002.807314
关键词
gate dielectric; HfO2; MOS capacitor; reliability; TDDB
Breakdown voltage distribution, Weibull slopes, and area scaling factors have been investigated for HfO2 gate dielectrics in order to gain a better understanding of the breakdown mechanism. Weibull slope of thick HfO2 (e.g., beta approximate to 4 for EOT = 2.5 nm) is smaller than that of SiO2 with similar physical thickness, whereas beta of the thinner HfO2 (e.g., beta approximate to 2 for EOT = 1.4 nm) is similar to that Of SiO2. The implication of the thickness dependence of beta is discussed.
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