Impact of abrasive particles on the material removal rate in CMP - A microcontact perspective

The effects of particle size within the chemical mechanical polishing (CMP) process are investigated using a microcontact wear model which considers the particle effects between the polishing interface during load balancing. The present theoretical results are in good agreement with the experimental data published previously. The current study provides a detailed understanding of the effects of the abrasive particles from an interfacial perspective. (C) 2004 The Electrochemical Society.