Edge-spreading lithography (ESL) has been extended to fabricate gold structures with different geometries and feature sizes on silicon substrates. In the present variant of ESL, we used photoresist structures patterned on a thin film of gold to transport alkanethiol molecules from an elastomeric stamp to the gold surface where they formed a self-assembled monolayer (SAM) along the edge of each resist feature. The emerging SAM could expand laterally on the gold via reactive spreading, during which the footprints of the resist structures were enlarged in the same fashion. Upon removal of the photoresist, selective etching of gold revealed those regions that were protected by the SAM, yielding accurate outlines of the resist features on the substrate. The width of resultant gold structures was determined by the distance over which the monolayer expanded during spreading, and could be conveniently controlled well below 200 nm by varying the contact time and/or the concentration of alkanethiol in the ink.
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