期刊
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS
卷 44, 期 50-52, 页码 L1509-L1511出版社
JAPAN SOC APPLIED PHYSICS
DOI: 10.1143/JJAP.44.L1509
关键词
plasma CVD; low-k; nanoparticles; LSI; ILD; porous film; dielectric constant
Nanoparticle composite porous films having a dielectric constant of epsilon(r) = 1.7-3.5 have been deposited using plasma chemical vapor deposition. Nanoparticles as nano-building blocks and radicals as adhesives are generated in plasmas, and nanoparticles are deposited together with radicals on substrates to form porous films. Nano-sized pores are dispersed in the films and their dielectric constants are controlled by the concentrations of pores, i.e., their porosities. The method is applicable to depositing nanoparticle composite porous films for other applications.
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