Fabrication of nanoparticle composite porous films having ultralow dielectric constant

Nanoparticle composite porous films having a dielectric constant of epsilon(r) = 1.7-3.5 have been deposited using plasma chemical vapor deposition. Nanoparticles as nano-building blocks and radicals as adhesives are generated in plasmas, and nanoparticles are deposited together with radicals on substrates to form porous films. Nano-sized pores are dispersed in the films and their dielectric constants are controlled by the concentrations of pores, i.e., their porosities. The method is applicable to depositing nanoparticle composite porous films for other applications.