期刊
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
卷 153, 期 4, 页码 C254-C257出版社
ELECTROCHEMICAL SOC INC
DOI: 10.1149/1.2172555
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This paper reports an in situ Raman study of Cu electrodeposition from an acidic sulfate solution in the presence of bis-(3-sulfopropyl)-disulfide Na salt (SPS). In the absence of chloride, in situ surface-enhanced Raman spectra scarcely show few labile features in a narrow range of cathodic potential. When Cl- ions are added to the deposition bath, several features are clearly visible in the spectra, showing that SPS is adsorbed on the copper surface in a wide potential window during Cu electroplating.
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