4.6 Article

Electrodeposition of Cu into a highly porous Ni/YSZ cermet

期刊

JOURNAL OF THE ELECTROCHEMICAL SOCIETY
卷 153, 期 8, 页码 A1539-A1543

出版社

ELECTROCHEMICAL SOC INC
DOI: 10.1149/1.2208908

关键词

-

向作者/读者索取更多资源

The electrochemical deposition of Cu into 0.12 cm and 60 mu m thick, highly porous (65 vol %) Ni/yttria-stabilized zirconia (YSZ) cermets was investigated. An electrochemical cell in which the electrolyte solution was allowed to flow through a porous Ni/YSZ substrate was used to eliminate mass-transfer limitations and to determine the conditions for which the potential drop in the electrolyte solution was minimized and a uniform Cu layer was produced throughout the porous substrate. The conditions determined from these experiments were then used to electrodeposit Cu throughout a thin, porous Ni-YSZ cermet anode layer on a solid oxide fuel cell (SOFC) using a standard nonflow-through setup. This SOFC was found to exhibit stable operation while using methane as the fuel. (c) 2006 The Electrochemical Society.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.6
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据