期刊
IEEE TRANSACTIONS ON MAGNETICS
卷 42, 期 1, 页码 51-55出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TMAG.2005.859438
关键词
electroplating; microelectromechanical systems (MEMS); Permalloy; stress; switches
The residual stress in the electroplated magnetic films is an important factor that limits the functionality of many micromagnetic devices. We have investigated the stress in electroplated Ni-Fe alloy for MEMS as a function of bath concentration, utilizing the wafer-bending method. Our investigation demonstrated that a low-concentration plating solution decreases the residual stress in the electrodeposits, and the stress is further decreased by increasing the saccharin additive content. We obtained the low-stress Permalloy Ni-81 Fe-19 in our experimental conditions. We fabricated a bistable electromagnetic RF MEMS switch with deformation-free cantilever beam using the electroplated Permalloy.
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