An integrated system for setting the optimal parameters in IC chip-package wire bonding processes

The wire bonding process is the key process in an IC chip-package. It is an urgent problem for IC chip-package industry to improve the wire bonding process capability. In this study, an integrated system is proposed to identify and control parameters in the wire bonding process in order to achieve high level performance and quality. First, an experimental design with Taguchi method is applied to identify the critical parameters in the wire bonding process. Then, an ANN is used to establish the nonlinear multivariate relationships between wire boning parameters and responses. Finally, a GA is adopted to find the most desired parameter settings by using the output of ANN as the fitness measure. Another popular method, response surface method, for parameter design problems is conducted for comparison purpose. Results of this comparison demonstrate the effectiveness of the proposed approach.