期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 45, 期 1, 页码 98-103出版社
SPRINGER
DOI: 10.1007/s11664-015-4109-6
关键词
MWCNT; electroless deposition; reinforcement
资金
- Directorate For Engineering
- Div Of Chem, Bioeng, Env, & Transp Sys [1417043] Funding Source: National Science Foundation
- Div Of Chem, Bioeng, Env, & Transp Sys
- Directorate For Engineering [0966908] Funding Source: National Science Foundation
In this study, the effect of Cu-coated multi-walled carbon nanotubes (MWCNTs) on the tensile strength of 70Sn-30Bi solder alloy has been investigated. Copper was first deposited onto metal-activated MWCNTs by an electroless process and confirmed with a scanning electron microscope and energy dispersive spectroscopy. Sn-Bi alloy solder was reinforced with Cu-coated MWCNTs with additions of 0.5 wt.%, 1 wt.%, 2 wt.%, and 3 wt.%, respectively. 70Sn-30Bi solder was produced by melting pure tin and bismuth in an inert gas atmosphere. Cu-coated MWCNTs were then added into the metal matrix by cold rolling, followed by hot pressing to disperse the carbon nanotubes (CNTs) in the matrix. Tensile tests were conducted on an mechanical testing and simulation (MTS) tester. The tensile strength was found to be proportional to the addition of Cu/MWCNTs, and about 47.6% increase in tensile strength over the pure alloy has been obtained for an addition of 3 wt.% Cu/MWCNTs. The Cu coating may enhance CNT dispersion to prevent tangling.
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