期刊
IBM JOURNAL OF RESEARCH AND DEVELOPMENT
卷 51, 期 5, 页码 605-633出版社
IBM CORP
DOI: 10.1147/rd.515.0605
关键词
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We are inspired by the beauty, and simplicity of self-organizing materials and the promise they hold for enabling continued improvementsi in semiconductor technology. Self assembly is the spontaneous arrangement of individual elements into regular patterns; under suitable conditions, certain materials self organize nanometer-scale patterns of importance to high-performance microelectronics applications. Polymer self assembly is a nontraditional approach to patterning integrated circuit elements at dimensions and densities inaccessible to traditional lithography methods. We review here our efforts in IBM to develop and integrate self-assembly processes as high-resolution patterning alternatives and to demonstrate targeted applications in semiconductor device,fabrication. We also provide a framework for understanding key requirenients for the adoption of polymer self-assembly processes into semiconductor technology, as well as a discussion of the ultimate dimensional scalability of the technique.
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