期刊
MATERIALS LETTERS
卷 61, 期 16, 页码 3526-3530出版社
ELSEVIER
DOI: 10.1016/j.matlet.2006.11.128
关键词
thick film; ultra-fine; Cu powders; lead-free glass; microstructure; solid solution
In this paper, non-agglomerated monodispersed ultra-fine copper metallic powders have been synthesized with chemical reduction method. Fine lead-free glass powders were also prepared by solid synthesis process. Thick film paste prepared by above-mentioned copper metallic powders and lead-free glass powders was applied as conductive paste of MLCC. Mixture of glass and zinc oxide give the thick film a high adhesion strength which is attributed to the rough interface from interfacial reaction between glass and chip, and a good densification. Diffusion of metal between copper thick film and nickel thick film is clear. Ni-Cu solid solution appears under high temperature firing. (c) 2006 Elsevier B.V. All rights reserved.
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