p-GaN surface treatments for metal contacts

The chemical bonding and electronic properties of wet, chemically treated p-GaN surfaces were studied using synchrotron radiation photoemission spectroscopy. Chlorine-based chemical bonding was identified on the conventional HCl-treated p-GaN surface, which is associated with a shift of the surface Fermi level toward the conduction band edge by similar to 0.9 eV with respect to the thermally cleaned surface. Compared to the HCl-treated surface, the surface Fermi level on the KOH-treated surface lies about similar to 1.0 eV closer to the valence band edge, resulting in a much smaller surface barrier height to p-type materials than the HCl-treated surface. The smaller surface barrier height to p-GaN after KOH treatment can lead to a lower contact resistivity and can play an important role in lowering the metal contact resistivity to p-GaN. (C) 2000 American Institute of Physics. [S0003-6951(00)03004-7].