期刊
PHYSICAL REVIEW E
卷 61, 期 2, 页码 1743-1754出版社
AMERICAN PHYSICAL SOC
DOI: 10.1103/PhysRevE.61.1743
关键词
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The glass transition temperature T-g and the temperature T-alpha corresponding to the peak in the dielectric loss due to the cu process have been simultaneously determined as functions of film thickness d through dielectric measurements for polystyrene thin films supported on glass substrate. The dielectric loss peaks have also been investigated as functions of frequency for a given temperature. A decrease in T-g was observed with decreasing film thickness, while T-alpha was found to remain almost constant for d>d(c) and to decrease drastically with decreasing d for d
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