期刊
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
卷 9, 期 1, 页码 146-151出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/84.825789
关键词
electro-thermal response; micro beams; post-buckling; resistive heating; thermal actuators; thermal buckling; thermoelasticity
Self-buckling behavior of micromachined beams under resistive heating is described by an electromechanical model with experimental verifications. This model consists of both electro-thermal and thermo-elastic analyses for beam-shape polysilicon microstructures that are fabricated by a standard surface micromachining process. When an input electrical current is applied, joule-heating effects trigger the thermal expansion of beam structures and cause mechanical buckling. The standard testing devices are clamped-clamped bridges, 2-mu m wide, 2-mu m thick, and 100-mu m long. It is found that a minimum current of 3.5 mA is required to cause beam buckling. Under an input current of 4.8 mA, a lateral deflection of 2.9+/-0.2 mu m at the center of the bridge is measured with a computer image processing scheme. The experimental measurements are found to be consistent with analytical predictions. A discussion of modeling considerations and process variations is presented. [412].
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