期刊
ULTRAMICROSCOPY
卷 81, 期 3-4, 页码 279-288出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/S0304-3991(99)00184-9
关键词
transmission electron microscopy; electron diffraction; specimen-related methods specifically for solid interfaces and multilayers
类别
Epitaxial semiconductor layers, in particular II-VI compound semiconductors with the component Se deposited on III-V semiconductor substrates like GaAs or InAs, can contain high densities of stacking faults. CdxMg1-xSe layers with Cd-concentrations x of 93% and 57% on InAs(0 0 1) substrates were investigated as typical representatives of this class of heterostructures. The defect structure of the layers is dominated by a high density of stacking fault (SF) pairs bound by Shockley partial dislocations with Burgers vectors b = 1/6[112] and a stair-rod dislocation with b = 1/6[110] at the intersection line of the pairs. Plan-view transmission electron microscopy (TEM) is generally applied to obtain information about the type, density and arrangement of the stacking faults in thin epilayers up to moderate SF densities. Cross-section TEM is more frequently carried out for thick layers and at high SF densities. It will be demonstrated by a detailed analysis of cross-section images that a careful interpretation of the observed SF morphologies is necessary due to artifacts induced by the cross-section geometry. (C) 2000 Elsevier Science B.V. All rights reserved.
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