End-point detection of reactive ion etching by plasma impedance monitoring

For the practical application of end-point detection of etching using plasma-impedance monitoring, the factors determining the impedance were clarified using an electric circuit model of a reaction chamber. In the model, plasma is approximated by a conductor, and the floating capacitance and wafer of a powered electrode, as well as the powered-electrode sheath (the sheath formed between the plasma and powered electrode), are approximated by capacitors. Calculated values obtained using the model agree well with measured values obtained by an impedance monitor installed between the powered electrode and the matching network. Based on this result, it was inferred that the impedance depends on the powered-electrode sheath-voltage and electron density, as well as on the floating capacitance and area of the powered electrode, the dielectric constant and thickness of the wafer, and the electron temperature. Next, the end-point detection method of etching by impedance monitoring was applied to reactive ion etching of SiO2 films, and the following finding was confirmed: the change in the impedance significantly depends on the RF power and the exposed area ratio (the ratio of etched area to wafer area) on the wafer. In addition, the feasibility of detecting the point of change of the exposed area ratio on the wafer, where the area size varies during etching, by detecting microchanges in the impedance, was demonstrated. As a result, the possibility of highly accurate end-point detection of etching by impedance monitoring was confirmed.