期刊
IEEE ELECTRON DEVICE LETTERS
卷 22, 期 4, 页码 182-184出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/55.915607
关键词
germanium; resonant tunneling diodes; silicon; strain
Resonant tunneling diodes (RTDs) with strained i-Si0.4Ge0.6 potential barriers and a strained i-Si quantum well, all on a relaxed Si0.8Ge0.2 virtual substrate were successfully grown by ultra high vacuum compatible chemical vapor deposition and fabricated using standard Si processing methods. A large peak to valley current ratio of 2.9 and a peak current density of 4.3 kA/cm(2) at room temperature were recorded from pulsed and continuous dc current-voltage measurements, the highest reported values to date for Si/Si1-xGex RTDs. These de figures of merit and material system render such structures suitable and highly compatible with present high speed and low power Si/Si1-xGex heterojunction field effect transistor based integrated circuits.
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