期刊
JOURNAL OF APPLIED PHYSICS
卷 89, 期 7, 页码 3685-3694出版社
AMER INST PHYSICS
DOI: 10.1063/1.1350623
关键词
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The interfacial stresses in, and the curvature of, an elongated trimaterial assembly, subjected to the change in temperature, are predicted based on an approximate structural analysis (strength-of-materials) model. The obtained results can be helpful in stress-strain evaluations and physical design of trimaterial assemblies in microelectronic and photonic packaging. (C) 2001 American Institute of Physics.
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