期刊
JOURNAL OF MATERIALS RESEARCH
卷 16, 期 6, 页码 1822-1828出版社
MATERIALS RESEARCH SOCIETY
DOI: 10.1557/JMR.2001.0251
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Superplastic behavior of heavily drawn Cu-at.% Ag filamentary microcomposite wires was investigated. The filamentary microstructure tended to break up at high temperatures by spheroidization, grooving, and/or recrystallization because of its high interface energy and high cold-work energy. Above 400 degreesC, extensive recrystallization occurred and the grains 300-500 nm in size were observed in the Cu matrix. As the deformation proceeded, the elongated silver lamellae and/or the region with numerous filaments broke up and rearranged into chevron patterns, which mostly lay perpendicular to the loading axis. The elongation up to 1000% was obtained at 500 degreesC at the strain rates of 7 x 10(-4)/s and -3 x 10(-3)/s, and the elongation up to 600% was obtained at 400 degreesC at the strain rate of 1 x 10(-4)/s. Arrays of dislocations in the matrix and near grain and phase boundaries were observed after superplastic deformation, supporting the slip-accommodated grain and/or phase boundary sliding.
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