4.5 Article

Heat transfer in microchannel devices using DSMC

期刊

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
卷 10, 期 2, 页码 274-279

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/84.925780

关键词

direct simulation Monte Carlo (DSMC); Knudsen number; wall heat flux

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The heat transfer characteristics of supersonic flows in microchannels is studied using direct simulation Monte Carlo (DSMC) [1] method. The velocity components and the spatial coordinates of the simulated particles are calculated and recorded by using a variable-hard-sphere (VHS) [2] collision model, The effects of Knudsen number (Kn) on the heat transfer of the microchannel flows are examined. The results show that the magnitude of the temperature jump at the wall increases with increasing Kn, The heat transfer to the isothermal wall is found to increase significantly with Kn, The possible causes for the increase of wall heat transfer are discussed.

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