A model of chemical mechanical polishing

A model of chemical mechanical polishing is presented which quantitatively correlates the polishing rate with the slurry concentrations of both chemicals and abrasives. The model predicts that as the concentration of either chemicals or abrasives is increased, an initial steep rise in the polishing rate is followed by an asymptotic approach to a maximum rate. The causes and implications of this behavior are discussed. (C) 2001 The Electrochemical Society.