期刊
APPLIED PHYSICS LETTERS
卷 78, 期 23, 页码 3598-3600出版社
AMER INST PHYSICS
DOI: 10.1063/1.1371251
关键词
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The electromigration threshold in copper interconnects is reported in this study. The length-dependent electromigration degradation rate is observed and quantified in the temperature range of 295-400 degreesC. Based on the Blech electromigration model [I. A. Blech, J. Appl. Phys. 47, 1203 (1976)], a simplified equation is proposed to analyze the experimental data from various combinations of current density and interconnect length, as well as to estimate the electromigration threshold product of current density and line length, (jL)(th), at a certain temperature. The resulting (jL)(th) value appears to be temperature dependent, decreasing with increasing temperature in the tested range between 295 and 400 degreesC. (C) 2001 American Institute of Physics.
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