期刊
APPLIED THERMAL ENGINEERING
卷 21, 期 16, 页码 1593-1605出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/S1359-4311(01)00042-4
关键词
thermal conduction; thermal conductivity; thermal paste; thermal contact; composite; interface
Materials for thermal conduction are reviewed. They include materials exhibiting high thermal conductivity (such as metals, carbons.. ceramics and composites), and thermal interface materials (such as polymer-based and silicate-based pastes and solder). (C) 2001 Elsevier Science Ltd. All rights reserved.
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