4.2 Article

Improved Photocatalytic Activity of Copper Heterostructure Composites (Cu-Cu2O-CuO/AC) Prepared by Simple Carbothermal Reduction

期刊

AUSTRALIAN JOURNAL OF CHEMISTRY
卷 67, 期 5, 页码 749-756

出版社

CSIRO PUBLISHING
DOI: 10.1071/CH13456

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资金

  1. National Natural Science Foundation of China [21243005]
  2. Science and Technology Foundation of Liaoning of China [201102011]
  3. Program for Key Science and Technology Platforms in the Universities of Liaoning Province
  4. Program for Liaoning Excellent Talents in University [LJQ2011050, LR2011011]
  5. Science and Technology Public Benefit Foundation of Liaoning of China [[2011]49]

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Cu-Cu2O-CuO/activated carbon heterostructure composites with visible-light activity have been successfully synthesized by a simple carbothermal reduction procedure using CuSO4 as a single precursor. The resultant samples were characterized by X-ray diffraction, transmission electron microscopy, and X-ray photoelectron spectroscopy measurements. The results showed that the Cu-Cu2O-CuO composites with size less than 10 nm dispersed well on the surface of activated carbon. Activated carbon played both a reducing agent and support role in the formation of Cu-Cu2O-CuO/activated carbon heterostructure composites. X-ray photoelectron spectroscopy analysis suggests that the outside of the nanoparticles is CuO and the inside of the nanoparticles is Cu metal and Cu2O. Moreover, the composition of Cu-Cu2O-CuO/activated carbon composites can be tailored by varying the Cu loading, heat-treatment temperature, and heat-treatment time. The photocatalytic activities of the catalysts were investigated by degrading reactive brilliant blue KN-R under visible-light irradiation. The Cu-Cu2O-CuO/activated carbon heterostructure composites showed excellent photocatalytic activity compared with other catalysts (pure CuO, Cu2O, Cu2O/activated carbon, CuO/activated carbon, and Cu2O-CuO/activated carbon), which is ascribed to synergistic action between the activated carbon support and photoactive copper species, and the presence of interfacial structures such as a Cu2O/CuO heterostructure, Cu/Cu2O (or CuO) Schottky barrier, and Cu2O/Cu/CuO ohmic heterojunction.

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