期刊
ACTA MATERIALIA
卷 50, 期 5, 页码 1197-1209出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/S1359-6454(01)00421-9
关键词
thin films; multilayers; surfaces & interfaces; nanofilms; interface failure; theory & modeling; structural behavior
The failure by debonding of 400 nm Al thin films on 152 mum-thick polyimide substrates has been studied in uniaxial tension experiments. To explain the edge debond of the Al film, the shear stress field along the film-substrate interface is determined. An analytical solution for the stress field exhibits a square root singularity near the free edges. The associated stress intensity factor is calculated in closed form by an asymptotic analysis. For a given loading, the stress intensity factor decreases with increasing length-to-thickness ratio of the film, and with decreasing film-to-substrate stiffness ratio. Governed by a single, dimensionless parameter, these trends are reported quantitatively in the form of a plot. Close correspondence is found for the interfacial shear stresses predicted by the presented method and by a finite element analysis. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
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