期刊
POLYMER TESTING
卷 21, 期 2, 页码 177-179出版社
ELSEVIER SCI LTD
DOI: 10.1016/S0142-9418(01)00066-6
关键词
coefficient of thermal expansion; epoxy composition; fillers
Several compounds were used to design epoxy composites which would exhibit appropriate coefficients of thermal expansion (CTE): bisphenol A and diethyleneglycol based epoxy resins, seven different fillers and two hardeners. The CTE of these epoxy compositions with crystalline and amorphous filter was determined and its peak-like behavior as a function of temperature evaluated. (C) 2001 Elsevier Science Ltd. All rights reserved.
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