期刊
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
卷 11, 期 5, 页码 556-565出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2002.802903
关键词
localized heating; MEMS packaging; microresonators; vacuum encapsulation; wafer level packaging
A glass vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. A constant heat flux model shows that heating can be confined locally in the dielectric layer underneath a microheater as long as the width of the microheater and the thickness of silicon substrate are much smaller than the die size and a good heat sink is placed underneath the silicon substrate. With 3.4 W heating power, similar to0.2 MPa applied contact pressure and 90 min wait time before bonding, vacuum encapsulation at 25 mtorr (similar to3.33 Pa) can be achieved. Folded-beam comb drive mu-resonators are encapsulated and used as pressure monitors. Long-term testing of vacuum-packaged mu-resonators with a Quality Factor (Q) of 2500 has demonstrated stable operation after 69 weeks. A p-resonator with a Q factor of similar to9600 has been vacuum encapsulated and shown to be stable after 56 weeks.
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