Reactive ion etching of quartz and Pyrex for microelectronic applications

The reactive ion etching of quartz and Pyrex substrates was carried out using CF(4)/Ar and CF(4)/O(2) gas mixtures in a combined radio frequency (rf)/microwave (muw) plasma. It was observed that the etch rate and the surface morphology of the etched regions depended on the gas mixture (CF(4)/Ar or CF(4)/O(2)), the relative concentration of CF(4) in the gas mixture, the rf power (and the associated self-induced bias) and microwave power. An etch rate of 95 nm/min for quartz was achieved. For samples covered with a thin metal layer, ex situ high resolution scanning electron microscopy and atomic force microscopy imaging indicated that, during etching, surface roughness is produced on the surface beneath the thin metallic mask. Near vertical sidewalls with a taper angle greater than 80degrees and smooth etched surfaces at the nanometric scale were fabricated by carefully controlling the etching parameters and the masking technique. A simulation of the electrostatic field distribution was carried out to understand the etching process using these masks for the fabrication of high definition features. (C) 2002 American Institute of Physics.