3.9 Article Proceedings Paper

Enhanced electronic system reliability - Challenges for temperature prediction

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCAPT.2002.808001

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physics of failure; prediction; reliability; standards; telecommunication; thermal

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Using telecommunication as an example, it is argued that the electronics industry badly needs a change in attitude toward reliability thinking. The role of thermal design and reliability qualification is discussed in context to current industrial needs for short design cycles and rapid implementation of new technologies. Current and future practices are discussed in the context of newly-emerging reliability standards. Finally, two multi-company projects targeting the improvement. of reliability through better temperature-related information are described.

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