期刊
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
卷 25, 期 4, 页码 533-538出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCAPT.2002.808001
关键词
physics of failure; prediction; reliability; standards; telecommunication; thermal
Using telecommunication as an example, it is argued that the electronics industry badly needs a change in attitude toward reliability thinking. The role of thermal design and reliability qualification is discussed in context to current industrial needs for short design cycles and rapid implementation of new technologies. Current and future practices are discussed in the context of newly-emerging reliability standards. Finally, two multi-company projects targeting the improvement. of reliability through better temperature-related information are described.
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